3rd International Conference on Design, Simulation, Manufacturing: The Innovation Exchange (DSMIE-2020) focuses on a wide range of research challenges in the fields of Manufacturing Engineering, Materials Engineering, Mechanical Engineering and Chemical Engineering, addressing current and future trends in design approaches, simulation techniques, computer-aided systems, software development, ICT tools and Industry 4.0 strategy implementation for engineering tasks solving.

DSMIE-2020 brings together researchers from academic institutions, leading industrial companies and government laboratories located around the world for promoting and popularization of the scientific fundamentals of manufacturing. The working language of the conference (including conference proceedings, presentations and discussions) is English.

Authors are welcome to submit original and unpublished research articles and case studies, reviews papers. All paper submissions to the DSMIE-2020 should be related to the conference topics and each paper will be peer-reviewed by at least two members of the program committee and evaluated based on originality, technical and/or research content/depth, correctness, originality, completeness, contributions and readability.

Authors should submit their papers online using the EasyChair Conference Management System. Unregistered authors should first create an account on EasyChair to log in. The submission page for DSMIE-2020 is https://easychair.org/conferences/?conf=dsmie2020.

Deadline for paper submission: October 15th 2019.

After the careful reviewing process all accepted papers will be published as conference proceedings and will be submitted to the Scopus database and other indexing services.

Accepted papers must be presented at the conference by one of their authors, who commit to register and attend the conference. The Steering Committee reserve the right to exclude papers which have not been presented from the proceedings.

The invitation letter to the conference can be found here.

The leaflet with brief information about the conference can be found here

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